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Additive Interconnection of EEE components using Silver Sintering Nanotechnology


Project ADIESSN wants to show the feasibility of advanced and efficient manufacturing resulting in strong and highly conductive interconnections of 2D and 3D structures.

The challenge:

  • Connect silver sintering as interconnection technology with 3D metal printing for advanced manufacturing.
  • Develop a method and materials to use silver containing filaments for 3D printing.
  • Realise difficult and 3D shape structures for interconnection of wires, stamping parts.